Rogers RO4360 RF PCB 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Overview:
RO4360G2 laminates from Rogers Corporation are advanced materials characterized by a dielectric constant (Dk) of 6.15 and low loss properties. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials provide an ideal balance of performance and processing ease. RO4360G2 extends Rogers' portfolio of high-performance materials, offering a lead-free process capable solution that enhances rigidity for improved processability in multi-layer board constructions while reducing material and fabrication costs.
RO4360G2 laminates process similarly to FR-4 and are compatible with automated assembly. They feature a low Z-axis coefficient of thermal expansion (CTE), providing design flexibility, and maintain a high glass transition temperature (Tg) consistent with the RO4000 product line. These laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminates in multi-layer designs.
With a Dk of 6.15 (Design Dk 6.4), RO4360G2 laminates enable designers to reduce circuit dimensions in applications where size and cost are critical. They are an excellent value choice for engineers working on designs such as power amplifiers, patch antennas, ground-based radar, and other general RF applications.
Features and Benefits
Thermoset Resin System
1.Specially formulated to meet 6.15 Dk
2.Ease of fabrication; processes similar to FR-4
3.Material repeatability
4.Low loss
5.High thermal conductivity
6.Lower total PCB cost compared to competing PTFE products
Low Z-axis CTE / High Tg
1.Design flexibility
2.Plated through-hole reliability
3.Compatible with automated assembly
Environmentally Friendly
1.Lead-free process compatible
Regional Finished Goods Inventory
1.Short lead times and quick inventory turns
2.Efficient supply chain management
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Base Station Power Amplifiers
Small Cell Transceivers
Patch Antennas
Ground-Based Radar
PCB Capability
PCB Capability (RO4360G2) |
|
PCB Material: |
Hydrocarbon Ceramic-filled Thermoset Materials |
Designation: |
RO4360G2 |
Dielectric constant: |
6.15 ±0.15 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP etc.. |
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Data Sheet of RO4360G2
RO4360G2 Typical Value |
|||||
Property |
RO4360G2 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.15 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
2.5 GHz/23℃ |
|||||
Dissipation Factor,tanδ |
0.0038 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Conductivity |
0.75 |
|
W/mK |
50℃ |
ASTM D-5470 |
Volume Resistivity |
4.0 X 1013 |
|
Ω.cm |
Elevated T |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
9.0 X 1012 |
|
Ω |
Elevated T |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
784 |
Z |
V/mil |
|
IPC-TM-650 2.5.6.2 |
Tensile Strength |
131 (19) 97(14) |
X Y |
MPa (kpsi) |
40 hrs 50%RH/23 |
ASTM D638 |
Flexural Strength |
213(31) 145(21) |
X Y |
Mpa (kpsi) |
40 hrs 50%RH/23 |
IPC-TM-650, 2.4.4 |
Coefficient of Thermal Expansion |
13 14 28 |
X Y Z |
ppm/℃ |
-50 ℃to 288℃ After Replicated Heat Cycle |
IPC-TM-650, 2.1.41 |
Tg |
>280 |
|
℃ TMA |
|
IPC-TM-650 2.4.24.3 |
Td |
407 |
|
℃ |
|
ASTM D3850 using TGA |
T288 |
>30 |
Z |
min |
30 min / 125℃ Prebake |
IPC-TM-650 2.2.24.1 |
Moisure Absorption |
0.08 |
|
% |
50℃/48hr |
IPC-TM-650 2.6.2.1 ASTM D570 |
Thermal Coefficient of er |
-131 @10 GHz |
Z |
ppm/℃ |
-50℃ to 150 ℃ |
IPC-TM-650, 2.5.5.5 |
Density |
2.16 |
|
gm/cm3 |
RT |
ASTM D792 |
Copper Peel Stength |
5.2 (0.91) |
|
pli (N/mm) |
Condtion B |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 File QMTS2. E102765 |